Physics / mechanism
Competitive landscape
ABF’s principal competitor at finer pitches is glass core substrates (Corning, AGC) — better CTE match to silicon, lower loss tangent, but immature SAP ecosystem. Silicon interposers (TSMC CoWoS, Intel EMIB) offer <1 µm RDL but at 5–10× cost. Fan-out panel-level packaging (FOPLP) eliminates the substrate entirely but struggles with die placement accuracy at scale. Embedded die approaches (AT&S ECP) compress z-height. For RF/mmWave, LTCC and liquid crystal polymer (LCP) substrates compete on loss but not density.
Companies using
Connected ideas
Sources
Frontier (open questions)
- To be added.