Logic, alt paradigms, edge inference, quantum. How instructions become physics — and the substrates competing to do it.
DRAM, HBM, NAND — and the emerging layer: MRAM, RRAM, PCM, photonic, memcapacitor. The memory wall is where AI scaling breaks; this is where it gets repaired.
Imaging, ranging, MEMS, quantum sensing. How machines measure the world.
Wireless, fibre, optical interconnect, quantum. How things talk to each other — from 5G and DECT NR+ to fibre, CPO, and QKD.
Generation, storage, carbon capture, power electronics, thermal. The substrate of everything else — getting electrons in and heat out at scale.
Lithography, packaging, equipment, foundry, deposition. How chips are made — and where the binding constraints on every other layer live.
Substrates, functional layers, advanced materials, coatings. What chips are made of — silicon and far beyond.
PIC platforms, light sources, displays, modulators, metasurfaces, photonic compute. Light as the carrier — increasingly the cheapest way to move and process information.
Biotech, neural interfaces, space, AI infrastructure, trust. The edges of the stack where deep-tech reaches into bodies, orbits, and institutions.
Embodiment and robot learning. Physical AI — where models meet motors, and the data flywheel decides who wins.
The chip lifecycle step by step: design, wafer, frontend fab, test, packaging. A guided walk through how sand becomes silicon.
Agents, models, inference economics, vertical AI, AI security. The layer where compute's value actually gets captured.